講座名稱：集成電路高端芯片封裝的發(fā)展史和未來(lái)發(fā)展方向

講座時(shí)間：2019-08-30 10:30:00

講座地點(diǎn)：北校區(qū)東大樓220

講座人：郭躍進(jìn) 教授

講座人介紹：

Dr. Yuejin GUO is a professor at Southern University of Science and Technology. He received Ph.D. degree from Caltech under William GODDARD in 1992, then He worked at Los Alamos National Lab as a postdoctoral research fellow. After that, he worked at Intel for over twenty years. Dr. Guo published two articles in Science, one article in Nature, and one article in PNAS. He participated in and then led Intel’s advanced packaging technologies such as flip chip and organic material-based packaging. Now almost all Intel’s advanced CPUs are housed in the packages developed by Dr. Guo.

講座內(nèi)容：

As IC moves to less than 10nm nodes, and Moore`s Law near stops. To improve IC performance, the packaging becomes more important. Here we will review advanced packaging history: from ceramic to organic, from wire-bonding to flip-chip, and to current Fan-Out packaging, 2.5D, and 3D packaging challenges.

主辦單位：微電子學(xué)院